Hi team,
In the datasheet, it says
"Exposed pad of the package. The exposed pad must be connected to AGND and the large ground copper plane to decrease thermal resistance"
When you look up tp the layout example, EP is connected to both AGND and PGND.
Is the "the large ground copper plane" in the discription same as the PGND?
Should they always connect EP to both of them?
Regards,
Ohashi
