For the LMZ14203HTZ/NOPB component, we have a few questions in terms of the thermal profile of this component. In the datasheet and in SNAA214, it specifies the reflow profile for the LMZ1 and LMZ2 components, as well as the max peak temperature. We would like to know what temp solder, or what kind of solder is used internal of the module, if any components are staked or glued, and what could happen above the peak temp listed on the LMZ14203HTZ/NOPB.