Hi,
Actually I'm working for experiment the BQ27510-G2 to replace in the future the BQ27510 that we use in our design
In first, I have some questions for the TI staff :
- When I developped my software for the BQ27510, someone said me in this forum that I had to used the subclass ID n° 57 for the manufacturer info (there were a mistake in the BQ27510 datasheet. In the BQ27510-G2 datasheet, the subclasse ID is still 58 (like BQ27510) ; is there again a mistake ?
- To create the Golden pack, I use the last version of BQEasy (V0.9.71) and there isn't the BQ27510-G2 DFI default file and it's impossible to find it of the TI website. Where can i find it ?
On BQEasy, I have a problem with the calibration register in the dataflash. When I use the calibrate windows, the device write board offset register with a dot (example 0.6). When I try to write this register directly in the dataflash windows it's impossible to have a dot (if I write 0.6, I see 0). is it possible to have information about that ?
For all the BQ27510-G2 that I tested, I saw that the component was in sealed mode with the hardware internal bit (A TI developper speak to me about that in this forum) and it's impossible to go back in full access mode without writing the firmware on component (.senc). This think will be a big problem is we used this component in mass production ; then I would like to know why the component is in this state (it wasn't the case for BQ27510)?
