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Hi Team,
We are using the LP38692SD-ADJ/NOPB LDO part in our Layout Board file. I had attached the images of the Board file and Schematics. Please review the layout and share your feedback with us.
The PCB we are using is of 12 Layers:
IC - Place on top
Layers 2,4,9 and 11 are Ground
Enable Signal is from L5
Thanks and regards
- Teja.
Hi Teja,
I looked at the schematics and layout portion that was shared.
Can you share the application for this device? This is an older LDO and we might have a better device with the given conditions.
Is there a reason to have two 0Ohms resistors in parallel at the input? it is common to see a 0Ohm jumper but I was curious to see why there are two in parallel.
This device does not have an active pull down on the EN pin, therefore, please make sure that the signal that drives EN does not go below GND level or higher than Vin. A pulldown resistor can be installed.
Be aware that there are some scenarios where reverse current can occur:
Layout looks ok, my biggest comment is that perhaps a newer LDO might provide a cleaner Layout since In and out tend to be on opposite sides with newer WSON packages.
This allows for better GND on the top, but overall it follows the recommended layout from the Data Sheet:
Here is a quick suggestion: TPS746 data sheet, product information and support | TI.com
Best,
Edgar Acosta
Hi Edgar Acosta,
Thanks for your Valuable feedback.
Thanks and regards,
- Teja
Hi Teja,
Thank you for the comments and information.
Is the pull down is on the other end, then I do not see a problem with this.
As for the thermal vias, it is highly suggested to place as many as possible. This will depend on the capabilities of the fabricator.
Other than this, everything looks good.
Best,
Edgar Acosta
Hi Teja,
Thank you for sharing such information.
As for the thermal vias, it is recommended to place as many as possible to help improve thermal performance.
Other than this, everything looks good. No further comments.
Best,
Edgar Acosta