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LM136-2.5-N: Temperature Allowances for Reflow, Processing, and Short Term Increases - bare die

Carrie Emmerich
Prodigy 10 points

Part Number: LM136-2.5-N

Our team is doing due diligence and trying to find if there is additional temperature guidance on 2 TI parts in bare die that we are using, beyond the Storage Temperature information on the datasheet.

Parts: 

LM136-2.5 MDR / 5962R0050101V9A  - bare die

LM119MD8 / 5962R9679801V9A  - bare die

  1. Is there any guidance on maximum temperature allowed for processing/reflow/short term temperature increase? We’re specifically looking for temperature limits above the Max Storage or Max Operating temps that we’ve found. This would be for the purpose of evaluating exposure to epoxy cure or solder reflow temperature during manufacturing.
  2. If there isn’t additional guidance above the Max Storage or Operating temps, what sorts of impacts would we expect to see from exposing parts to temperatures above this threshold?

Thanks!