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TPS7A92: Layout Review

Part Number: TPS7A92

Hi Team,

Greetings for the day.

We are using the TPS7A9201 LDO in our Layout Board file. I had attached the images of the Board file and Schematics. Please review the layout and share your feedback with us.

The PCB we are using is of 12 Layers:

IC and discrete parts - Place on Bottom

Layers 2,4,9 and 11 are Ground

Thanks and regards

- Teja.

  • Hello Teja,

    Some suggestions regarding the layout:

    1. Make the vias on the thermal pad as small as possible and add as many as possible.

    2. Connect GND plane from thermal pad to Pin 4 and make it bigger to improve thermals. If R257 already placed and routed to bottom might be good to add vias to allow extending GND plane.

    3. Components C252, R265 and R259 bring them as near as possible to the LDO for optimization.

    4. It is recommended to have C672 on the same side as the LDO. I would recommend moving R261 and R262 further away since having these components close don't have a big impact.

    5. Why is the FB15 used? It is not recommended to have them part of the LDO design since they can have an impact on transient performance.

    Best,

    Eunize Tobias