This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hi Team,
Greetings for the day.
We are using the TPS7A9201 LDO in our Layout Board file. I had attached the images of the Board file and Schematics. Please review the layout and share your feedback with us.
The PCB we are using is of 12 Layers:
IC and discrete parts - Place on Bottom
Layers 2,4,9 and 11 are Ground
Thanks and regards
- Teja.
Hello Teja,
I reviewed both schematic and layout. Some suggestions regarding the layout:
1. Make the vias on the thermal pad as small as possible and add as many as possible.
2. Connect GND plane from thermal pad to Pin 4 and make it bigger (like top side) to improve thermals.
3. C416, R450 and R453 bring them as near as possible to the LDO by moving R472 a little further away. For optimization is better to have closer loops.
4. Make the ground of C429 bigger.
5. Why is the FB35 used?
Best,
Eunize Tobias