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TLV759P: Thermal via layout

Shuji Ishiwata
Mastermind 8090 points
Part Number: TLV759P


Hi All,

I have a question about TLV759P.
The layout guidelines state that thermal vias should not be installed.

However, vias are listed in the LAND PATTERN.



Which is correct?

Best Regards,
Ishiwata

  • 0
    TI__Guru 50025 points

    Hi Ishiwata-san,

    It is true that vias directly beneath the thermal pad will wick some solder away. With that said, we regularly recommend putting the vias directly under the thermal pad, so I don't know why it was stated to not do so. Thermal performance will be best with them directly beneath the package. If that is a concern to you, the board manufacturer can fill the vias with copper so that there isn't a cavity to wick solder away. 

    Regards,

    Nick