I have a potential application where 2x16S modules will be stacked in parallel. Modules being in separated housings is driving the need for 2 BQ chips. Would the BQ communication work in this case?
Please check the image below:
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I have a potential application where 2x16S modules will be stacked in parallel. Modules being in separated housings is driving the need for 2 BQ chips. Would the BQ communication work in this case?
Please check the image below: