Hi i would like to do a review of the schematic for LM5176 that we are planning to use. Can we do it through private chats though?
Thanks and Regards
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Hi i would like to do a review of the schematic for LM5176 that we are planning to use. Can we do it through private chats though?
Thanks and Regards
HI Noel,
thank you for using the E2E forum,
You can use the private Email on the forum to send the schematic. (Click on my name - send private message)
Please drop a note here once done, as I am not as regularly checking the forum inbox as the forum content.
Best regards,
Stefan
HI Noel,
the phase margin with 40 Degree is very small - recommend to go over 60 Degree - please check over the full input voltage range - could not do the check as the attachment was only a pdf
connection of VIN is wrong
The current sense in the schematic shows 3 times 1k
Recommend to add a 0Ohm series resistor into the Gate lines of the MOSFET, in case need a resistor could be placed there.
Recommend to add a placeholder for a snubber on SW1 and SW2. So components can be placed if required, e.g. due to EMI
Move FB connection behind the big bulk cap - may add another small cap behind that as well
Best regards,
Stefan
By SW1 and SW2, do u mean (Q1 and Q2 as it is on my schematic) or both the high side switches (Q1 and Q3)?
Hi Noel,
put them from the SW1 to GND and from SW2 to GND - close to the MOSFETs.
Best regards,
Stefan
Aha ok got it! i thought you meant the mosfets. Got it cleared now. I will get back to you soon after the changes and with the PCB
THANKS for now!
Hi Noel,
Note: for a layout review we typically need 2-3 days.
So here we are:
- it looks like the ground plane is split from left (controller) to power stage.
This will limit the grounding of the LM5176
- the Current sense resistor should be connected via a Kelvin connection to the CS and CSG pins
- PGND (Pin 19) should be directly connected to the decoupling cap C19
- Connect all AGND ground related components to the AGND pin directly
- do you have vias on the Thermal pad to connect the Thermal pad to the GND layer for Thermal connection.
Please check out the layout recommendations in the datasheet chapter 10.
And also this article gives many recommendations:
Best regards,
Stefan
Hi Stefan
Ok got it!
it looks like the ground plane is split from left (controller) to power stage.
This will limit the grounding of the LM5176
Can you suggest ways to improve the Grounding connections??
Also please check the private chat as i have uploaded an updated board for review.
Hi Noel,
Stefan has forwarded me the layout files, as I will take over this thread.
I will review the updated board and get back to you within 1-2 days.
Thank you very much for your patience.
Best regards,
Niklas
Hi Noel,
Sorry for the long delay.
I took a review of the Gerber files Stefan provided to me and overall the layout looks good to me.
There is one thing I noticed, where I have a question back for you:
The ground plane still looks like it is split in several parts. Now I am not sure if I got provided the most updated files. (You may send them to me in private chat as well)
Connecting all grounds together has the benefit of better heat sink and no drift by any of the GND planes. For example, if the planes are completely split, one ground can drift to a level of 1V, while the other ground is still at 0V. This can lead to system instability.
To avoid drift, the minimal connection should be one low impedance path between all ground layers. If you have the space available, larger plane connections are even better.
Thanks and best regards,
Niklas
Thank you so much Niklas!
Ya i did not provide the updated files. The GND has since been connected.