TLV75710PDBVR - Thermal performance

Kevin Raman

Hi, currently in our design we are dropping 1.8V to 1V, 1A output using a fixed LDO (MPN: TLV75710PDBVR)

We are drawing 790mA from the LDO and we found that the temperature to reach 75 degrees.

Is there any way for us to reduce this temperature or could there be a different LDO IC that can support our application?

Thanks in advance

over 2 years ago

0 Juliette over 2 years ago

TI__Mastermind 18466 points

Hello Kevin,

Is the top of the case reaching 75 degrees? Are you reaching thermal shutdown with the 75 degrees?

Best,

Juliette

0 Kevin Raman over 2 years ago in reply to Juliette

Prodigy 70 points

Hi Juliette,

Yes, the case is reaching 75 degree celcius.

No, we are not experiencing thermal shutdown at 75 degree celcius.

I'm trying to explore the methods to improve the thermal performance of our current LDO design.

0 Juliette over 2 years ago in reply to Kevin Raman

TI__Mastermind 18466 points

Hey Kevin,

The switcher team has an app note on the effects of PCB design on thermal performance. https://www.ti.com/lit/pdf/snva424

We typically recommend increasing your ground copper planes and in some cases adding thermal relief bias throughout. You may also add heat sinks to your PCB design to improve on the Jedec standard.

speaking of the JEDEC standard, we have an app note explaining the effects of PCB layout on thermal values https://www.ti.com/lit/pdf/slvae85

I will ask the marketing team to see if they have a part they would recommend over this one

Best,

Juliette

0 Juliette over 2 years ago in reply to Juliette

TI__Mastermind 18466 points

Hey Kevin,

Marketing was able to get back to me, see below:

We have TLV75710PDRVR it’s the WSON package version of what they are using. It also more than halves the thermal resistance.

Best,

Juliette

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TLV75710PDBVR - Thermal performance