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LM5108: The board layout of LM5108DRCR

Makoto Oka
Prodigy 550 points
Part Number: LM5108


Here is the question from my customer. Please help on this.

In the example board layout of LM5108DRCR, there are 4 holes Φ 0.2 on the big pad. Does it mean it’s better to place the holes on the big pad as symmetrically as possible when we use it? Please help to check.

  • 0
    TI__Mastermind 23215 points

    Hello Makoto,

    Thank you for the interest in the LM5108 half bridge driver. For the consideration of connecting the power pad to a ground plane to optimize thermal conduction, it makes sense that you would target distributing the vias over the power pad boundary to have a uniform thermal resistance.

    One consideration may be to keep the center of the power pad free of vias to avoid excessive wicking of the solder paste into the vias.

    Regards,