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Original question:

LP5900: Dropout Capability clarification

LP5900: Power management - INTERNAL forum

Bella (GZ) Li
Intellectual 915 points
Part Number: LP5900

Hi team,

Some question about LP5900 from the customer side

  1. Is it 2.5D/3D package chip?
  2. What bonding process does it use? (Gold Line?)
  3. If it is WLCSP package, are they RDL or FOC structure (Direct Bumping)?  The process without UBM and PI/PBO is prohibited in customer side.
  4. Is it an ECP packaged chip?
  • 0
    TI__Expert 4200 points

    Hello Bella,

    1. The devices only have one die in the package.

    2. Is there a specific reason customer needs to know the bonding process? The device is REACH and RoHS compliance.

    3. LP5900 it is available in DSBGA, also known as WCSP. Which uses Cu as a RDL to connect the silicon interconnect to an array of solder balls which also has UBM.

    4.No

    Best,

    Eunize Tobias