Hi All,
I have a question about the layout of the TPS25947.
Do you recommend VIA for VIN and VOUT as in the layout below?
From the SOLDER MASK DETAILS below, the Φ0.3mm VIA is too large.
Would Φ0.2mm be okay?
Best Regards,
Ishiwata
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Hi All,
I have a question about the layout of the TPS25947.
Do you recommend VIA for VIN and VOUT as in the layout below?
From the SOLDER MASK DETAILS below, the Φ0.3mm VIA is too large.
Would Φ0.2mm be okay?
Best Regards,
Ishiwata
Hi Shuji,
Yes vias are recommended. The vias under the device also help to minimize the voltage gradient across the IN and OUT pads and distribute current uniformly through the device, which is essential to achieve the best on-resistance and current sense accuracy.
Using 0.2mm should be fine.
Regards
Kunal Goel