The customer have a project using BQ40Z80 for 7-series, but there has always been a problem in their production line, which triggered the anti-cracking mechanism of the IC and required re-burning the software. Therefore, they wanted to understand the following three questions:
1. According to previous communication records, the anti-cracking of IC is judged by the voltage of TS1. Could you please explain the logic of anti-cracking in detail? How much greater is the voltage? How long does it last? At which stage the judgment was cracked.
2. They found that when they equip the battery cell, the IC will be activated by mistake. Generally, when the third cell is applied, the IC is activated. Will the activation of the IC during this power-on process cause the IC Flash to be erased?
3. They found that every time the IC is activated, TS1 will have an abnormal spike, as shown in the figure below, what is the reason for the spike?
