TPS546D24A: Heat Sink Load

Hi Shinichi,

This will depend on the effective thermal resistance to the board and ambient. As well as the ambient temperature.

What is the output power (voltage and current)?

I've link this APP note as well for your reference: Understanding Thermal Dissipation and Design of a Heatsink

Thanks,

Joseph

Joseph,

Perhaps, my word "load" might have made you misunderstand my question. What I mean is not an output load but a "mechanical load" of the heat sink on the top surface of the package. I suspect that "mechanical pressure" or "weight" could be another term to mean it.

I guess a heavy mechanical load of a heat sink might have an impact on device performance or could damage the package itself. Therefore, I suspect there should be a limitation on the mechanical load of the heat sink, and my question asks about it.

Best regards,
Shinichi Yokota

Hi Shinichi,

I'm checking with internal team and will let you know when I hear back.

Thanks,

Joseph

Joseph,

Have you got any feedback from the team?

Best regards,
Shinichi Yokota

Hi Shinichi,

I never got a response from the team responsible; I sent another message to them and will let you know as soon as I hear back.

Thanks,

Joseph

Hi Shinichi,

TI recommends 20 Newtons of force uniformly applied, there is usually more margin, but this is the standard recommendation.

Thanks,

Joseph