LM22672: LM22672

Hi,

Sorry to hear about the issues.

Is the IC getting hot or is the inductor or both?

Can you provide the part number of L303 and D309?

Some items on the layout:

1. Thermal reliefs on pin connections are not recommended
2. How big is the board?
3. Is there a continuous ground plane underneath the IC to help in dissipating heat?

From what I can tell, only the IC are getting hot in thermal camera. Not the Inductor.

L303: TDK: VLS6045EX-6R8M

D309: Micro Commercial Co: SK36A-LTP

2. The board is 140mm x 85mm

3. Yes, using a four layer board. In the above attached picture you can see the connection to the thermal pad. Layer 2 is a uninterrupted GND plane.

Hi Mattias, thank you for the additional info. None of the answers to the questions seem troubling.

I would suggest confirming that you have good solder coverage on the DAP of the IC. It may be a good idea to install another unit on the board following the recommended reflow profile and see if the same behavior is seen.

If the issue persist, it may be also be a good idea if you can replicate the behavior on the EVM with the EVM input and output hooked up to your board input and output.

Thanks for your time.

I will try getting a hold on an EVM and see if that makes any difference. 

You are welcome. Sounds good. I hope the debug steps help you get to root cause.