LMG1210: Recommended via under thermal pads - solderpaste leakage risk?

Vasileios Adamopoulos

Part Number: LMG1210

Hello,

I am designing a pcb using the LMG1210. In the recommended layout and footprint sections of the datasheet, there are thermall vias under the thermal pads. Is it ok to use 0.25mm (not filled) vias under the thermal pads? I am afraid that solderpaste might leak during reflow, leading to worse thermall dissipation, compared to not having vias underneath. Do you have any experience or recomendations on this aspect?

p.s. the PCB technology I have to use doesen't permit tented,filled or smaller vias

Kind Regards,

Vasileios

over 1 year ago

0 Richard Herring over 1 year ago

TI__Mastermind 23215 points

Hello Vasileios,

Thank you for the interest in the LMG1210. When I research this on the web I see the usual recommendation to fill or tent the thermal vias to prevent solder from wicking away from the pad. I do see that the 0.25mm is ~9 mils which is not a large via.

I found an app note on ti.com that does give recommendations for power pad layout. You can find it here:

https://www.ti.com/lit/an/sloa120/sloa120.pdf?ts=1697729491464&ref_url=https%253A%252F%252Fwww.google.com%252F

It seems to imply that vias dont necessarily need to be filled, but please confirm the advice compared to your application.

Regards,

Power management

Power management forum

LMG1210: Recommended via under thermal pads - solderpaste leakage risk?