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TPS560430XFEVM: Typical overshoot at SW Node

Martin Seeger
Expert 5381 points
Part Number: TPS560430XFEVM
Other Parts Discussed in Thread: LMR43610

Hi Team,

the application note / users guide of the TPS560430XFEVM is fairly thin compared to other buck converters.

Do you have any measurement data about the overshoot/understood of V_SW?

The customer did their own design and waits for their proto PCBs. In this time they wanted to draft a first test protocol and they asked about the characteristics of the overshoot/understood. Fully understood that this will be layout dependent and that the transient abs max value of 38V from the d/s will be the one to guarantee.

Still a good question to get a rough understanding if we talk about 5...10..50% transients.

Cheers
Martin

  • 0
    TI__Genius 12955 points

    Hi Martin,

    Section 9.2.3 of the device datasheet shows a full load transient to show the output overshoot and undershoot under that condition. There are other scope images in the section to show performance of the device: https://www.ti.com/lit/ds/symlink/tps560430.pdf

    Are you talking about output transients or overshoot/undershoot relating to the switch node voltage?

    Best regards,

    Ridge

  • 0 in reply to Ridge Lahti
    TI__Expert 5381 points

    Hi Ridge,

    overshoot/undershoot relating to the switch node voltage -> that's what I meant with SW and V_SW.

    Best Regards
    Martin

  • 0 in reply to Martin Seeger
    TI__Genius 12955 points

    Hi Martin,

    Thank you for clarifying. The EVM would be a good way to determine typical overshoot and undershoot on the SW node. This would be more so best case as the EVM is the ideal layout for the device. Overshoot and undershoot tends to be worst at max loading and max Vin. This is a leaded package device and the pinout is not as optimized as some other devices. If SW node ring is a concern, LMR43610 may be a better choice for this design.

    Best regards,

    Ridge Lahti