Can the internal portions of the part withstand eutectic (Sn63Pb37) soldering of the thermal pad to a PWB pad (can we apply hot solder right onto the backside of the part body)? Solder can be 183 °C to 220 °C
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Can the internal portions of the part withstand eutectic (Sn63Pb37) soldering of the thermal pad to a PWB pad (can we apply hot solder right onto the backside of the part body)? Solder can be 183 °C to 220 °C
Hi Jamie,
Here are the recommended board-level assembly guidelines: Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and Form
This can be found on the device's web page in case you need to reference it in the future.
There are a few additional related details in this similar E2E: https://e2e.ti.com/support/power-management-group/power-management/f/power-management-forum/957680/tps7a4501-sp-reflow-temperature-rating
Thanks,
Sarah