Does TI have any information about test coupon that was used to measure junction-to-ambient thermal resistance?
I don't see any mention of this on the datasheet, or figures showing relationship between copper and thermal resistance.
Thanks!
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Does TI have any information about test coupon that was used to measure junction-to-ambient thermal resistance?
I don't see any mention of this on the datasheet, or figures showing relationship between copper and thermal resistance.
Thanks!
Hello,
For more information on the thermal metrics for thermal resistance calculations, please refer to the following document: https://www.ti.com/lit/an/spra953c/spra953c.pdf?ts=1698865431431&ref_url=https%253A%252F%252Fwww.ti.com%252Flit%252Fds%252Fsymlink%252Ftps274160.pdf%253Fts%253D1698865400309%2526ref_url%253Dhttps%25253A%25252F%25252Fwww.ti.com%25252Fproduct%25252FTPS274160
Best Regards,
Elizabeth