TPS74801: Chipset downward force tolerant data

Hi Jim, 

Hope you are doing well. I have forwarded this question to my packaging team, and we should be expecting an answer shortly. 

Hi Jim,

I reached out to the team and I have some questions for you to get a better answer. 

• Would you please provide the pkg designator for this device? 
• Do you have more details on the conditions – i.e., before or after unit soldered on PCB, for heatsink applications, dimensions of heatsink, dimension of the applied force, etc.?
  
  

I am looking forward to a response from you.

Thank you,

Josh Nachassi

Hi Nachassi,

Customer is considering the case of the LDO be covered by thermal pad and spring screw heatsink in long term.

Please refer to the stacking as below:

Hi Jim,

Hope you had a great weekend. Thanks for this information. What is the package designator that you are curious about?

Thank you,

Josh Nachassi

Hi Nachassi,

Sorry, I didn't get your point, what is package designator?

Customer needs downward max force they can do on the device.

Hi Jim, 

I understand, I sent this question to the team that would give me the best response for the device and they said to ask for this information from you. I will send them what you sent me and get back to you with a reply. They want to know which package you are using.

Thank you,

Josh Nachassi

Hi Nachassi,

Thanks for the support. below is the package customer using, thanks.

Hi Jim,

Thank you for sending me this. I have forwarded this information to the person best suited. I am waiting for a reply, I will let you know as soon as I hear back.

Thank you,

Josh Nachassi

Hi Nachassi,

Need your help to expedite the process, thanks.

Hi Jim,

I have sent out the email but got no response, I will follow up with them. I understand the urgency of this matter.

Thank you,

Josh Nachs

Hi Josh,

Need you help to push for the data, thanks again.