Hi ,
We are using BQ25790 in our Battery Charger circuit.
We have designed and ordered PCB and we have connected with Stencil manufacturer for stencil.
We have followed datasheet as below for solder paste opening on stencil.
Our Stencil vendor has a concern that if we If we follow the design with 4 mil stencil thickness then the Area ratio for the pads is 0.625 but as per IPC standard 7525 it should be above 0.67 to dispense the paste properly from its aperture .
The required area ratio can be achieved if we reduce the stencil thickness to 3.5 / 3 mil with above suggested design.
We will be using OMNIX 338 SAC 305 solder paste. Is recommendation above(datasheet) is valid for OMNIX 338 SAC 305 solder paste or it is considering other type of solder paste.
Please recommend if we need to change stencil thickness to 3.5mil from 4mil to achieve aperture ratio .
Thanks and Regards,
Dhiraj Phadte
