BQ25638: Thermal Properties

Part Number: BQ25638

Hi team, 

1. What is the theta JA and JC for the package
2. For this package form factor is DSBGA, is there an effective thermal conductivity calculated?
3. Would this package be also developed in QFN form-factor, as the thermal dissipation is higher. In some of our products, a QFN charger IC has been used and could dissipated power losses up to ~1.5-2W without a thermal solution.

Thanks!