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UC2901: Thermal Management

Antonio Montanez
Prodigy 10 points
Part Number: UC2901
Other Parts Discussed in Thread: UC1901

Hello, 

I do not see any thermal resistance values for the UC2901 part in the spec sheet. Can you provide thermal resistance values, such as Theta_jc, Theta_jb, Theta_ja? 

Also is it typical/ designed for this component to be top-cooled?

Antonio Montanez
Collins Aerospace 

  • 0
    TI__Mastermind 26605 points

    Antonio,

    Since it doesn't contain a driver OUT stage like a PWM controller, I anticipate the expected  power dissipated in UC2901 is very low. As far as "cooling", I've seen similar LCC packages cooled using thermally conductive epoxy over the perimeter of the package and bonded to as much conductive copper on the top layer as possible but again, these were for IC packages including drive stages dissipating much higher potential power. Because the UC2901 is a legacy IC nearly 30 years old, I will not be able to produce the missing thermal impedance numbers you are asking about. If you select an exact package, we may be able to find a separate power management device in the same package, consider using whatever thermal impedances are given for that device and apply them to UC1901 - this is a crude approach but I expect the result would yield higher calculated junction temperature than what the UC1901 might experience in a working circuit?

    Regards,

    Steve