TPS7B7701-Q1: standoff

Shinji Tsuji

Genius 13058 points

Part Number: TPS7B7701-Q1

Hi team,

Could you please advise the min/typ/max standoff of TPS7B7701/2 device below?

regards,

10 months ago

0 Josh Nachassi 10 months ago

TI__Expert 5231 points

Hi Shinji,

You can see the measurement of the standoff on the data sheet as you attached. Can you please elaborate on the additional information you would like?

Thank you,

Josh

0 taichi.orikasa 9 months ago in reply to Josh Nachassi

Prodigy 110 points

Dear Josh,
In order to optimize the solder mask opening ratio of the THERMAL PAD,
I would like to know the actual value of 0.15/0.05.

Best Regards,

0 Stephen Ziel 9 months ago in reply to taichi.orikasa

TI__Mastermind 33915 points

Hi Taichi,

I have reached out to the packaging team on this request and I'll let you know when I have a response. Please be aware that it may take 1-2 weeks.

Thanks,

Stephen

0 taichi.orikasa 9 months ago in reply to Stephen Ziel

Prodigy 110 points

Dear Stephen

Thank you for your response.
However, this is very urgent and necessary information, so I would like to ask you to provide it early.
Thank you for your consideration.

Best Regards,

0 Stephen Ziel 9 months ago in reply to taichi.orikasa

TI__Mastermind 33915 points

Thanks Taichi, as soon as I hear back from the packaging team I will let you know.

Thanks,

Stephen

0 Stephen Ziel 9 months ago in reply to Stephen Ziel

TI__Mastermind 33915 points

Hi Taichi,

I heard back much quicker than expected from the packaging team. Here is their response:

"TI follows JEDEC spec for MO-153 package standoff of 0.05-0.15mm. TI suggests customers to fabricate the stencil with 0.125mm thickness. With 0.125mm thick stencil there should be no issue to have the component thermal pad solder onto the PCB."

Thanks,

Stephen

0 taichi.orikasa 9 months ago in reply to Stephen Ziel

Prodigy 110 points

Dear Stephen

Thank you for your response.
I understand that it is JEDEC compliant, but I would like to know the actual value.
Could you please provide us with the following information?
・Variation in standoffs
・Process Capability Index (Cpk)

Best Regards,

0 Stephen Ziel 9 months ago in reply to taichi.orikasa

TI__Mastermind 33915 points

Hi Taichi,

We typically cannot provide Cpk values or things of that nature as that offers insight into our proprietary design processes. Even still, I'll reach out to packaging again to obtain their reply.

Thanks,

Stephen

0 Stephen Ziel 9 months ago in reply to Stephen Ziel

TI__Mastermind 33915 points

Hi Taichi,

We can provide the following information:

Number of Samples : 458272

Range : 0.0818 – 0.1267 mm

Average : 0.108mm

CPK : 2.127

Thanks,

Stephen

0 taichi.orikasa 9 months ago in reply to Stephen Ziel

Prodigy 110 points

Dear Stephen

Thank you for your answer.
I review your answers.
If there is anything, I will contact you again.

Best Regars,

Power management

Power management forum

TPS7B7701-Q1: standoff