Hello,
The recent PCN that qualified a 2nd ATE site for the TPS61043 has a very different thermal pad. The new pad is larger and does not have fingers extending to the edge of the VSON package and my customer is concerned about the change. Can my customer continue to use the original land pattern on their production PCB:
With the new package that has this new recommended land pattern:
The original land pattern has fingers extending to teh edge of the package with solder mask that will be under the plastic portion of the package with the new thermal pad shape and size.
John
