TPS61043: New VSON thermal pad changes

John Griffith

Part Number: TPS61043

Hello,

The recent PCN that qualified a 2nd ATE site for the TPS61043 has a very different thermal pad. The new pad is larger and does not have fingers extending to the edge of the VSON package and my customer is concerned about the change. Can my customer continue to use the original land pattern on their production PCB:

With the new package that has this new recommended land pattern:

The original land pattern has fingers extending to teh edge of the package with solder mask that will be under the plastic portion of the package with the new thermal pad shape and size.

John

9 months ago

0 Zhiqian Wu 9 months ago

TI__Mastermind 22275 points

Hi, Brian

Patrick is out of office this morning, he will reply you once he came back to the office.

0 Patrick Yao 9 months ago

TI__Mastermind 27000 points

Hi John,

It is ok to use previous land pattern, but we recommend customer to follow new package because in the future only the new package will be shipped.

Patrick

0 John Griffith 9 months ago in reply to Patrick Yao

TI__Mastermind 21533 points

Hi Patrick,

This is a bit frustrating. Packaging doesn't seem to think that the old footprint should be used with the new device, and the PCN makes it sound like there are two ATE sites since it says "Qualification of TI CDAT as an additional Assembly site for select devices." It says additional, not new assembly site. We should probably make that more clear and update teh PCN to not say no changes to form, fit, and function since this change affects the PCB design for customers.

John

0 Patrick Yao 9 months ago in reply to John Griffith

TI__Mastermind 27000 points

Hi John,

In the future only package from CDAT will be shipped, so we recommend new land pattern design as well.

Patrick

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TPS61043: New VSON thermal pad changes