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PCB copper area w.r.t charac params

Hi.. i had a doubt related to TPS series IC..

To decide the PCB Copper area for a given IC, we need to check the characterization parametres psi(jb), psi(jt) .. rather than theta(ja)..

 (ref. to datasheet http://www.ti.com/lit/ds/symlink/tps73525.pdf    pages 12 and 13     and     http://www.ti.com/lit/an/sbva025/sbva025.pdf   page 10 )  

AM I r8 ??

 

at a given junction temp (say 70 deg C) we need to know the power dissipation hence the above params as to how they change with temp.

So we need a graph of junction temp versus Power disspaton, as due to Power dissiaption, the Tj rises

Am I r8??

hence charac params change??

 

AM I r8??

 

Thus we need a graph that will give the variation of charac. params with temp or with power dissipation?

AM I r8??

hence to maintain a rated characterisation parametre... we need to know.. the PCB copper area required to dissipate the heat... 

AM I r8??

Also the variation of PCB copper area w.r.t charac params??

 

Am i r8??

 

I hope the ques. is understood


Thank you

 

Smita