Hi Team,
My customer was reviewing the LM2594M-5.0, and they are trying to assess if the device is solder temperature sensitive. They had a few questions that I wanted to see if someone from the team can address:
Per the TI datasheet, the D8 (SnPb finish) package option provides absolute maximum temperatures for vapor phase and IR reflow processes, and the MSL value for this package is 1.
Is there any concern for the D8 (SnPb) package being expose to 235C per TI’s AN-2029 Handling and Process Recommendations (refer to second screenshot)?
If there is not an issue of the D8 (SnPb) package being expose to the 235C temperature, then I would say for certain that it is not “Solder Temperature Sensitive”.
Regards,
JP