Hi Amuta,
Could you please share the footprint being used in your design? Below is the pitch measurement of the footprint of the model as well as the datasheet mechanical drawings. These are also the same footprint we used for our EVM.
Jesse
Hi Jesse,
Still I am unable to understand the concept of giving that much gap between the pad in land pattern. Lead not soldered properly due to that and as per IPC 7351 component leads must be placed atleast 75% on the pad but here it lesser than that.
So it will not affect the performance? Please explain. Check below img. Blue outline is our actual component and yellow color is copper pad. It's very clear that component leads not sit completely on the pcb footprint.
Hi Amuta,
This is to account for the the pin tolerance of the device, for example, for pins 2-6, at absolute minimum, the pin length is going to be .4mm. This give a .05mm over hang from the pad and at 87.5% pin to pad contact. At maximum length .6mm, we are looking at 58% pin to pad contact, but on average you should be looking at ~75% pin to pad contact.
This should not affect the performance of the device. This is the same footprint that our other customer is using and we have not encountered any issues related to the footprint dimension.
Jesse
