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bq51013 termal resistance

Kei Sato73562
Expert 2310 points
Other Parts Discussed in Thread: BQ51013

I　have 2 question.

1. There is THERMAL METRIC in datasheet p3
    Will the value of θjctop of package YFF be right?

    YFF package termal resistance is 0.2℃/W

    Power Dissipation：（150℃－25℃）/0.2 = 625W?

2. Will this thermal resistance be a subject with what kind of board?(size,layout,ex.....)

  • 0
    TI__Guru* 75646 points

    1.) Thermal Metric for bq51013 YFF (Die Size Ball Grid Array) on data sheet page 3.  Thermal resistance from Junction to Case (Top) of package is 0.2 C/W.  For the YFF package the Case Top is the die substrate, thermal resistance will be very good.

    But from a practical stand point cooling will only be provided through the board. 

    2.) Will thermal resistance be subject to what kind of board, such as size and construction?  Yes—the thermal data in the data sheet, Junction-to board is based on a standard industry test configuration. 

    See TI Document SPRA953 for additional information.

  • 0 in reply to Bill Johns
    Expert 2310 points

    Hello Bill

    Thank you for a reply.

    I confirmed SPRA953.

    But, There was not the description of bq51013(QFN20).
    Which Thermal resistance(D/S p3) is 1s or 2s2p
  • 0 in reply to Kei Sato73562
    TI__Mastermind 36110 points

    Thermal resistance is calculated using the high K board (2s2p)