LMG1205:

IOANNIS KALTSIDIS

Part Number: LMG1205

Hello Texas Instruments team,

I would like to ask a question about the part LMG1205YFXR . We would like to solder it using a SN/PB solder paste but since its Lead finish/ Ball material is SNAGCU what you would recommend for better results?

In addition, is there a possibility that the part LMG1205YFXR can be ordered with Leaded alloy on the solder Balls?

over 1 year ago

0 Pratik Adibatla over 1 year ago

TI__Expert 7473 points

Hi Ioannis,

Our expert is currently Out of Office as we're observing Mon (2/19) as a US holiday. We'll get back to you by the end of next business day.

Best,

Pratik

0 William Moore over 1 year ago in reply to Pratik Adibatla

TI__Genius 14145 points

Hey Ioannis,

Thank you for your question regarding the LMG1205.

It is recommended to match solder paste alloy and assembly process with the component bumps allow.

This is outlined in Section 7: Solder Paste, Reflow, and Cleaning in the DSBGA package document seen here: AN-1112 DSBGA Wafer Level Chip Scale Package

Therefore, it would be best if you use a SnAgCu solder paste instead.

Also, this part is only available in the DSBGA package with SnAgCu leads as the LMG1205YFXR.

Let me know if there are any further questions.

Thank you,

William Moore

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LMG1205: