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LM4041C: Need Support from Texas Instruments to authenticate the reported issue

Part Number: LM4041C

We have taken the complaint with Texas Instruments via CPR241095165 & this case was declined by Texas quality team as The visible copper is caused by the lead frame singleness process and has no impact on solderability / reliability. Same feedback we reviewed with our end customer & they do not agree with the feedback received from Texas Instruments. Hence, we are expecting support from Texas Instruments to authenticate the reported issue 

  • Hi Pravin, I wanted to reiterate what our Field Quality Engineer has already explained to you in detail. The exposed copper on the end of the leads is typical of most of our leaded packages with NiPdAu and relates to how the packages are manufactured. The visible copper is caused by the lead frame singulation process and has no impact on solderability / reliability. The solder joint itself gets its strength from the wetting angle from the backside of the lead and not the lead tip so wettability of the lead tip does not directly contribute to the strength of the joint. The reported visible copper is cosmetic only.

    Field Quality Engineering already provided you a copy of a document “TI Report - Visible Copper” describing this in more detail. 

    I also wanted to add that the LM4041C is a very mature device released since 2005. We have shipped over 24Mu since 2014 with no surface mount reported issue.