TPS23753A: Moisture absorption

Shuji Ishiwata

Part Number: TPS23753A

Hi All,

I have a question about TPS23753A.
The TPS23753A was left mounted and unpowered for 2 hours in an environment with a temperature of +55℃ and humidity of 93%.
Will MSL Level-1-260C-UNLIM be out of warranty?
I think there is a possibility that the IC will be damaged if the device is operated, but what do you think?

Best Regards,
Ishiwata

over 1 year ago

0 Diang Xing over 1 year ago

TI__Mastermind 37121 points

Hi Ishiwata,

Thanks for reaching out.

It is not a common question for us... I will reach out to the reliability team and get back to you later.

Best regards,

Diang

0 Shuji Ishiwata over 1 year ago in reply to Diang Xing

Mastermind 7845 points

Hello Diang,

Thank you for your reply.
I look forward to hearing from you.

Best Regards,
Ishiwata

0 Diang Xing over 1 year ago in reply to Shuji Ishiwata

TI__Mastermind 37121 points

Hi Ishiwata,

Thanks for your patience. I will remind the reliability team.

Best regards,

Diang

0 Diang Xing over 1 year ago in reply to Diang Xing

TI__Mastermind 37121 points

Hi Ishiwata,

Thanks for your waiting.

If the units are already soldered down to the application, this condition should be a low risk.

Is the +55℃ & humidity of 93% condition part of the system qualification or part of typical application?

Best regards,

Diang

0 Shuji Ishiwata over 1 year ago in reply to Diang Xing

Mastermind 7845 points

Hello Diang,

Thank you for your reply.

This is part of the system certification. The customer performed a temperature test.
As a result, abnormalities can be confirmed at each terminal, and leakage current can also be confirmed at the VDD terminal.

I think the product may have malfunctioned due to the temperature test. I would like to consult with you to get your opinion on whether the content of the temperature test is appropriate.

Is there a possibility that this could be a contributing factor to the failure?

Best Regards,
Ishiwata

0 Diang Xing over 1 year ago in reply to Shuji Ishiwata

TI__Mastermind 37121 points

Hi Ishiwata,

Thanks for your update.

I will forward your information to the reliability team and reply to you later.

Best regards,

Diang

0 Shuji Ishiwata over 1 year ago in reply to Diang Xing

Mastermind 7845 points

Hello Diang,

Thank you for your reply.

I would like an answer as soon as possible.

Best Regards,
Ishiwata

0 Brandon Beader over 1 year ago in reply to Shuji Ishiwata

TI__Genius 15275 points

Hi Ishiwata,

Diang, our PD Apps engineer is currently out of office. Please expect a delay in his response!

Regards,

Brandon

0 Shuji Ishiwata over 1 year ago in reply to Brandon Beader

Mastermind 7845 points

Hello Brandon,

Thank you for your replay.
I hope to receive an answer next week.

Best Regards,
Ishiwata

0 Diang Xing over 1 year ago in reply to Shuji Ishiwata

TI__Mastermind 37121 points

Hi Ishiwata,

Thanks for your patience. Will get back to you next week.

Best regards,

Diang

0 Shuji Ishiwata over 1 year ago in reply to Diang Xing

Mastermind 7845 points

I'm waiting for your answer. Please contact us as soon as possible.

0 Diang Xing over 1 year ago in reply to Shuji Ishiwata

TI__Mastermind 37121 points

Hi Ishiwata,

Thanks for your patience.

Please refer the App note linked below.

MSL Ratings and Reflow Profiles (Rev. A)

In general, since MSL1 Floor life is only Unlimited with condition ≤30ºC/85%RH, a re-bake is stated in TI MSL app note to get back there.

Pg 3:

Products that exceed their floor life can be re-worked with a bake to drive out residual moisture. The Reference Conditions for Drying Mounted or Unmounted SMD Packages table in IPC/JEDEC J-STD-033C provides guidance about the baking procedure and where you should take care to ensure that the plastic housing (trays, tape and reel or tubes) can withstand the temperatures being considered. Tape and Reel material should not be baked above 40°C due to risk of the packing material properties changes. A vacuum bake may be considered for IC packages without internal cavities.

Best regards,

Diang

0 Diang Xing over 1 year ago in reply to Diang Xing

TI__Mastermind 37121 points

Hi Ishiwata，

Please confirm if the failing unit was soldered on customer board.

Best regards,

Diang

0 Shuji Ishiwata over 1 year ago in reply to Diang Xing

Mastermind 7845 points

Hello Diang,

Thank you for your answer.

The failing nit was soldered on customer board.
It is soldered to a customer's board at +55°C and 93% humidity.

Is MSL1 applicable in this environment?

I don't think an environment with a temperature of +55℃ and 93% humidity is recommended, what do you think?

Best Regards,
Ishiwata

+1 Diang Xing over 1 year ago in reply to Shuji Ishiwata

TI__Mastermind 37121 points

Hi Ishiwata,

Thanks for your patience.

I could find a reliability condition for this IC at 130C/85%RH (96 Hrs). The 93% humidity in your condition may be too high.

If you have concerns about the failed units, you can consider to submit a failure analysis request.

Best regards,

Diang

0 Diang Xing over 1 year ago in reply to Diang Xing

TI__Mastermind 37121 points

Hi Ishiwata,

Since we did not get back from you for a long time. I will close this thread for now. Please reply or open a new thread if you have further questions.

Best regards,

Diang

Power management

Power management forum

TPS23753A: Moisture absorption