Hi TI team ,
We are using the chip TPS54360DDAR for generating -24V input from +24V .Recently we have observed from field that TPS54360DDAR is Burning .its burning at Vin Pin (Pin no 2) and short B/w SW (Pin 8) and Gnd
Initially its working fine(during production testing) after some time in the field its getting damaged (IC burn).From 2023 IC burn out issue is increased,so many IC's were burnt .We could see so many people have reported the same issue in TI forum ,but could not see an exact solution.
We have started to find and analyse the root cause
find the snapshot of design for your reference.
Please check the design and provide feedback on what could be the cause of an IC to burn
When we evaluate we see that all of the failed boards are produced using TPS54360 batch 2031 (see the image below)
Boards are produced after Jan 2023 and used above components from batch 2031. There are no changes to the design or process we follow in our production thus no variability from our side.
Can you please go a little deeper in this investigation and find what has change happened from the IC production? Was there any PCN related to process/production house/material, etc?
We still have 1200 pcs stock from the above batch and we are afraid that failures will continue. Let us know how to mitigate this risk? If you can suggest some testing which can at least identify the bad ones in production itself also save from failure from the field.
Also, 2500 pcs from another batch as well in stock (this we haven't used yet)
