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TPS25947: TPS259474LRPWR

Paolo Rege Cambrin
Prodigy 20 points
Part Number: TPS25947

I have to evaluate the dissipation capacity of this device considering that it will be encapsulated in a resin "brick" which allows for an θCA thermal resistance of approximately 2 °C/W.

How can I use the "Junction-to-top-characterization parameter"  ΨJT to thermally characterize the assembly? Is there a way to correlate  ΨJT with the junction-case thermal resistance?

Thanks in advance