1)What is the recommended action if encounter Noise issue on IC?
2)What means of TYP VIA ? This via is require to close or open?
3)Can I close the PCB via on thermal pad to solve the noise issue?
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1)What is the recommended action if encounter Noise issue on IC?
2)What means of TYP VIA ? This via is require to close or open?
3)Can I close the PCB via on thermal pad to solve the noise issue?
Hi Evonne,
Following the schematic and layout recommendations in the datasheet should help you avoid noise issues. If you do encounter a noise issue, you can return to the forum to seek guidance based on the particular noise issue you are facing.
There is no preference to having the thermal via tented or not. I don't forsee tenting or not impacting noise. I would choose based on your particular manufacturing requirements.
Having vias placed near the input capacitors and around the IC ground is recommended for low noise in addition to the other layout recommendations in the datasheet.