TPS65381A-Q1: Desoldering witout damage from board, how to proceed ?

Hi Ewelina,

This device is a bit tricky to desolder due to the powerpad on it. Here is a guide from us on how to rework devices with power pads. https://www.ti.com/lit/an/slma002h/slma002h.pdf

Doing this with just a soldering iron is really difficult. You need some soldering wick and flux. Apply flux to the leads and the wick then place the wick over the leads and place the soldering iron on the wick over each lead 1 at a time until no more solder gets wicked off. You need to repeat this for each pin to try and get as much solder off the pins as possible. You then need to apply hot air to the underside of the board, preferably to both sides to try and get the solder under the device (on the powerpad) to melt and be able to remove the device. If you didn't remove all of the solder from the leads you need to move the top source of hot air around to also try and melt the solder on the leads. The more solder that is on the leads the more difficult it is going to be to remove the device. Keep applying flux to the leads of the device to keep the heat where you want it as much as you can. Hope this helps.

Best,

Michael Hernandez