TPSM82912: Thermal Resistance value needed

Neeraj Singh

Prodigy 40 points

Part Number: TPSM82912

Can you please share junction to case (bottom) thermal resistance value for TPSM82912

3 months ago

0 Aurora Tie 3 months ago

TI__Genius 10270 points

Hi,

It is currently vacation time in China, and my colleague Emma is expected to reply to you next Monday. Thanks for your patience.

Aurora

0 Lucia Gao 3 months ago in reply to Aurora Tie

TI__Genius 17900 points

Hi Neeraj,

Pls kindly see thermal metric data as shown below:

BRs

Lucia

0 Neeraj Singh 3 months ago

Prodigy 40 points

Hi, this is a QFN package with an exposed pad at the bottom, so most of the heat would go to the bottom. therefore, junction to case (bottom) thermal resistance is required which is not mentioned in the thermal metric that you have shared.

0 Lucia Gao 3 months ago in reply to Neeraj Singh

TI__Genius 17900 points

Hi Neeraj,

I am not sure whether you want RθJB which is Junction-to-board thermal resistance. The junction-to-board thermal resistance, attempts to represent the thermal resistance between the package and the board with one number.

Semiconductor and IC Package Thermal Metrics (Rev. D) (ti.com)

Usually we don't provide junction to case (bottom) but we have junction to board to represent the thermal resisstance between the package and the board.

Thanks and kindly let us know if there is anything unclear.

BRs

Lucia

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TPSM82912: Thermal Resistance value needed