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BQ25792: Board design review

Part Number: BQ25792

Hi,

looking at the recommended PCB design, I'm not sure about the via count for connecting the inductor with SW1 & SW2, only 4 via...just don't seems right to me.

I plan to design a prototype PCB, and increase the via count from 4 to 10:

TI recommendation:

  

My design looks something like this:

The only thing I'm not so sure about is the GND connection at the IC top part. It is more narrow and far from the IC because of the 4 via supplement.

I do believe that 10 vias would be better than 4 regarding power losses and parasitic induction reduction.

Any thoughts? is this an over kill?

I would appreciate any comments.

Thanks

Nir  

  • Hello Nir,

    Please allow me time to review this question. I will provide an update after I gather more information.

    Best Regards,

    Christian.

  • Hello Nir,

    The only thing I'm not so sure about is the GND connection at the IC top part. It is more narrow and far from the IC because of the 4 via supplement.

    Yes, I would recommend making the GND connection wider and closer to the IC.

    I do believe that 10 vias would be better than 4 regarding power losses and parasitic induction reduction.

    Any thoughts? is this an over kill?

    I don't see any obvious issues using 10 vias, but 4 vias should be sufficient.

    .

    Best Regards,

    Christian.

  • Hi Christian,

    I agree about the GND connection. It's better to have a smaller current loop at PMID & VSYS - so I'll remove the additional 4 vias for SW1 and SW2

    As you can see, I managed to squeeze 6 via for SW1 and SW2 beneath the IC, so between 4 to 10 vias, 6 would still be better than 4 with no other compromises.

    Thanks for your review

    Nir