TPS7A7200-EP: package material question.

Kannan Sockalingam

Intellectual 1905 points

Part Number: TPS7A7200-EP

Hi there, I was reviewing the material content for this package, will the fused silica/carbon black/epoxy package be compatible with water soluble flux and aqueous cleaning?

The material and reliability sheet states the molding compound is fused silica/carbon black/epoxy (CAS #: 85954-11-6). More specifically, customer is wondering if the part would be susceptible to damage or if part markings could potentially get washed away.

over 1 year ago

0 David Pierpont over 1 year ago

TI__Intellectual 850 points

Hi Kannan,

Allow me to reach out to our packaging team and update you by Friday.

Thanks,
David

0 Kannan Sockalingam over 1 year ago in reply to David Pierpont

TI__Intellectual 1905 points

Hi, any update on this?

0 Bett Lofts over 1 year ago in reply to Kannan Sockalingam

TI__Intellectual 1940 points

Hi Kannan,

I will take from here, I am now checking with the expert.

+1 Bett Lofts over 1 year ago

TI__Intellectual 1940 points

Hi Kannan;

I am not an expert on these questions, so I had to go to some experts at SC packaging. Here is their response -

Only damage that I can see is it the package absorbs moisture. But this would be a risk for anything including the PCB board. I don’t see where aqueous cleaning would be damaging. We use DI water in our singulation process and deflash process for QFN.

The symbol marking should be a laser mark so there would not be a risk of washing off the symbol. May be some appearance change but the symbol would still be there.

Also I would assume, there would be a bake step after the cleaning process if subjected to at the customer end.

BR;

Bett

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TPS7A7200-EP: package material question.