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Hi there, I was reviewing the material content for this package, will the fused silica/carbon black/epoxy package be compatible with water soluble flux and aqueous cleaning?
The material and reliability sheet states the molding compound is fused silica/carbon black/epoxy (CAS #: 85954-11-6). More specifically, customer is wondering if the part would be susceptible to damage or if part markings could potentially get washed away.
Hi Kannan,
Allow me to reach out to our packaging team and update you by Friday.
Thanks,
David
Hi Kannan;
I am not an expert on these questions, so I had to go to some experts at SC packaging. Here is their response -
Only damage that I can see is it the package absorbs moisture. But this would be a risk for anything including the PCB board. I don’t see where aqueous cleaning would be damaging. We use DI water in our singulation process and deflash process for QFN.
The symbol marking should be a laser mark so there would not be a risk of washing off the symbol. May be some appearance change but the symbol would still be there.
Also I would assume, there would be a bake step after the cleaning process if subjected to at the customer end.
BR;
Bett