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TPS7A7200-EP: package material question.

Part Number: TPS7A7200-EP

Hi there, I was reviewing the material content for this package, will the fused silica/carbon black/epoxy package be compatible with water soluble flux and aqueous cleaning? 

The material and reliability sheet states the molding compound is fused silica/carbon black/epoxy (CAS #: 85954-11-6). More specifically, customer is wondering if the part would be susceptible to damage or if part markings could potentially get washed away.

  • Hi Kannan,

    Allow me to reach out to our packaging team and update you by Friday.

    Thanks,
    David

  • Hi, any update on this?

  • Hi Kannan,

    I will take from here, I am now checking with the expert. 

  • Hi Kannan;

    I am not an expert on these questions, so I had to go to some experts at SC packaging.  Here is their response  -

     Only damage that I can see is it the package absorbs moisture.  But this would be a risk for anything including the PCB board.  I don’t see where aqueous cleaning would be damaging.  We use DI water in our singulation process and deflash process for QFN.

    The symbol marking should be a laser mark so there would not be a risk of washing off the symbol.  May be some appearance change but the symbol would still be there.

    Also I would assume, there would be a bake step after the cleaning process if subjected to at the customer end.

    BR;

    Bett