TPS1H000-Q1: Recommended land pattern of thermal pad

Tiger,

Could you give me an example of where the land pattern is greater than the thermal pad? This would help for my own reference.

I believe the answer here is that the thermal pad for the Hxx devices is ground. Given it is a power switch, if the land pattern was larger than the thermal pad it would risk being too close to shorting the GND power pad with the VBB or VOUT lines. 

Best Regards,
Tim 

Hi Tim,

Please find red marks in below diagram for IC thermal pad and recommended land pattern.

Thanks and Best regards,

Tiger

Tiger,

Thanks- I realize the TPS1H000A-Q1 is like this, however could you refer to another part that has the landing pattern larger than the thermal pad? I generally have seen the landing pattern smaller to allow room for the soldering expansion.

Best Regards,
Tim

Hi Tim,

Sorry, I cannot understand what mean for referring to another part that has the landing pattern larger than the thermal pad.
If current drawing is correct, that's okay. Just double confirm this.

Thanks and Best regards,

Tiger

Thank you very much! Tim

Have a nice day.

Best regards,

Tiger