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LMG2100R044: Is a top metal pad for top-side cooling isolated from GND/SW node?

Kento Adachi
Expert 4465 points
Part Number: LMG2100R044

Tool/software:

Hello experts,

I believe LMG2100R044 has a top metal pad for top-side cooling.

Is the metal isolated form GND/SW node?

Could you please show me the internal structure (e.g. cross-section) from a die to the top metal pad?

Thanks,

Kento

  • 0
    TI__Expert 7435 points

    Hi Kento-san,

    The two pads on the top side of the package are not isolated. These are the exposed GaN FETs for optimal cooling. These are electrically connected to SW and PGND.

    Best,

    Kyle

  • 0 in reply to Kyle Wolf
    TI__Expert 4465 points

    Hello Kyle,

    I understood the two pads on the top side are not isolated.

    I feel it is a little bit dangerous because SW node can have high voltage. Do you have any comments on it?

    Also, if I want to set a heat sink on the top side, we cannot just put the heat sink on the both pads because it will short the SW and GND pad. Is that correct?

    Do you have any recommended heat sink assembly design for it?

    Thanks,

    Kento

  • 0 in reply to Kento Adachi
    TI__Expert 7435 points

    Hi Kento-san,

    Between the top side of device and heat sink there will be thermal interface material (TIM). This is an electrically isolating and thermally conductive material.

    Best,

    Kyle