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TPS82130: TPS82130 0.2mm clearance on land pattern

Jeroen Verhoeff
Prodigy 10 points
Part Number: TPS82130

Tool/software:

I am using the Solder Mask Defined (SMD) land pattern of the TPS82130 MicroSIP package. This SMD land pattern is however not compliant with the board required clearance of 0,2mm.
Is it possible to either shrink the copper under the SMD land pattern by 0,025mm, or make it a NSMD land pattern by interchanging the copper and the solder mask opening?

Can you recommend an option?

  • +1
    TI__Mastermind 21361 points

    Hi Sir，

    Usually we don't suggest change SMD land pattern. But if it is not compliant with the board required clearance , I think the first option you mentioned would be better, just make sure there is no electrical rule violation。

    Thanks

    Colin