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TLC77: TLC7705QD

Gamalier Rivera Villafañe
Prodigy 50 points
Part Number: TLC77

Tool/software:

Hello, 

PN TLC7705QD bondwire changed from Au to Cu per PCN # 20120808000. This change affected the dimensions of the SOIC package ? This change affected something else on the device besides the bond wire material ?

Thanks, 

Gamalier Rivera 

  • 0
    TI__Expert 8990 points

    Hi Gamalier, you are referring to a PCN issued from CY 2012.  The change is per what was published in the PCN notification i.e. "Qualification of an alternate material set for assembly with Au wire and add Cu as an additional wire base metal option for select devices in the SOIC package." There are no other changes made.