TPS54160A: New DGQ package

What about the size of the opening?

Hi Hirotsugu-san,

It is not recommended to reduce the solder mask opening to 1.75 x1 .89mm. Because the thermal performance of the device depends on the solder mask opening. 

Thanks,

Nitya

Hi Nitya,

However, it is necessary to create a board that is compatible with the two types of packages.
There is also an AN (SLMA002H) that says that the thermal resistance value does not change much if 50% of the power pad is solder covered.
We believe that the thermal characteristics will not change significantly even if the size is reduced slightly from the current version.

Best regards,

Hi Hirotsugu-san,

Agreed on the App note information. However in order to fully leverage the thermal performances from POWERPAD package it is always suggested to solder the complete exposed pad to the printed circuit board.

As you might know, in datasheet we cannot suggest customer to reduce the exposed PAD open area to incorporate both packages.

If you want to move ahead with small open area, I recommend you validate the performance of the package/board by collecting empirical data for the device.

Thanks,
Nitya

Hi Nitya-san,

There are two types of packages, and unless a compatible design example is shown, it will cause trouble for many customers.
I would like you to either separate the part numbers or show a common design example.

Best regards,

This may not be your team's role, but if I order from TI.com, which package will be shipped, and do I not know until it arrives?

Hi Hirotsugu-san,

I am checking internally about this and get back to you in couple of days.

Thanks,

Nitya