TLV62569A: Differences in package structure

Satoshi

Guru 19645 points

Part Number: TLV62569A

Tool/software:

The package structure of TLV62569ADRLR is different between the one obtained in the past and the one obtained this month.

Which one is correct, and would you let me know why it was changed?

(Changed from Bond Wire to Copper Post)

For your reference, the PCN was issued in February 2023, so I guess there was a change at that time.

[Old]

[New (2024' Jun)]

Best regards,

Satoshi

+1 Moheddin Pasha Shaik over 1 year ago

Hey Satoshi,

Thank you for using E2E,

There might be some confusion, the PCN that we had in Feb 2023 is related to the qualification of FAB site option for LBC9 devices.

FYI- SOT23-5 (DBV) is designed with a bonding wire interconnection structure, whereas the SOT563(DRL) uses the Flip Chip On Lead (FCOL) approach, for SOT563 package, die is on lead frame. Please find this app note for the package difference - Thermal Comparison of a DC-DC Converter in SOT23 and the New SOT563 (Rev. A) (ti.com)

Thank you & regards,

Moheddin.

0 Moheddin Pasha Shaik over 1 year ago in reply to Moheddin Pasha Shaik

Hi Satoshi,

If you don't have further questions, can you please close the thread by clicking on Resolved.

Thank you & regards,

Moheddin.

0 Satoshi over 1 year ago in reply to Moheddin Pasha Shaik

Guru 19645 points

Hi Moheddin,

Thank you for your kind support, and sorry for my reply delay.

These question was cleared.

Best regards,

Satoshi

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