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Original question:

CSD88599Q5DC: Can unified mosfet used on buck converters?

CSD88599Q5DC: Datasheet info is missing on top package "EXPOSED HEAT SLUG"

Fong Brian
Prodigy 60 points
Part Number: CSD88599Q5DC
Other Parts Discussed in Thread: TIDA-01485, CSD88584Q5DC, TIDA-00774

Tool/software:

Dear TI,

I am puzzled by the datasheet information that why is the potential of the top "EXPOSED HEAT SLUG".

Do it connected to the VIN, PGND or VSW?

Any documents on heatsink mounting or placement whitepaper?

Bests,

Brian

  • 0
    TI__Mastermind 32105 points

    Hi Brian,

    Thanks again for your interest in TI FET products. The exposed heat slug on the topside of the package is internally connected to the source of the low side FET which is PGND. Please see Thermal Consideration in section 7.1.2 of the CSD88599Q5DC datasheet for information on heat sinking. There is no formal documentation for heat sinking but you can see some examples in the following TI reference designs:

    TIDA-01485 uses a pin fin heat sink (Wakefield Vette pn 904-27-2-23-2-B-0) and thermal conductive pad (Laird Technologies pn A15727-00) as shown on page 28 of the design guide. More information can be found in the bill of materials.

    TIDA-0074 was tested with a heat sink. I'll see if I can get you a part number.

    Best Regards,

    John Wallace

    TI FET Applications

  • 0 in reply to John Wallace1
    TI__Mastermind 32105 points

    Correction: TIDA-00774 which used the CSD88584Q5DC (same package with lower voltage FETs).

  • +1 in reply to John Wallace1
    TI__Mastermind 32105 points

    HI Brian,

    I believe we have discussed this device at length and will close this thread.

    Thanks,

    John