Tool/software:
LM4040CIM3-3.0/NOPB: We had observed Copper exposure on the component lead. Even we had RCA ,from TI as "the exposed copper on the end of the leads is typical of most of our leaded packages with NiPdAu and relates to how the packages are manufactured. The visible copper is caused by the lead frame singleness process and has no impact on solderability / reliability. The solder joint itself gets its strength from the wetting angle from the backside of the lead and not the lead tip so wettability of the lead tip does not directly contribute to the strength of the joint. The reported visible copper is cosmetic only".
We are looking avoid of copper exposure.Any corrective actions will also do here.
Can we get here with Gold or NiPdAu , The mass shall be with this composition only. Without Copper & its alloy (344ppm) . As Gold is better at bond wire
From Material composition.
Leadframe:
Copper: 6.06mg , can it be achieved around 2-3mg?
We are predicting these could be also for copper exposures observed.
Kindly provide feedback which shall resolved copper exposure observed.
