TLC77: TLC7705QD

Gamalier Rivera Villafañe

Part Number: TLC77

Tool/software:

Hello,

PN TLC7705QD bondwire changed from Au to Cu per PCN # 20120808000 issued from CY 2012. The part mass changed because of this bondwire change ? If it did, please provide the mass of device with gold bond wire and with copper bondwire.

Thanks,

- Gamalier Rivera

over 1 year ago

0 Lorena Dudman over 1 year ago

TI__Expert 8990 points

Hi! The part mass change from Au to Cu wire is not significant or negligible. The mass of the leadframe & mold compound are the significant ones compared to the wire.

0 Gamalier Rivera Villafañe over 1 year ago in reply to Lorena Dudman

Prodigy 50 points

ok, thanks for the information! Please, confirm that TLC7705QD device has a mass with copper bondwire of 0.09675304 g. Also, can you please provide the mass of the device with gold bondwires. The change is negligible, but currently an analysis is needed of both devices and the mass needs to be compared.

+1 Lorena Dudman over 1 year ago in reply to Gamalier Rivera Villafañe

TI__Expert 8990 points

Hi, the mass as published in TI.com product content page of 0.09675304g is correct. The mass with gold wire is estimated to be 0.05% lighter.

0 Gamalier Rivera Villafañe over 1 year ago in reply to Lorena Dudman

Prodigy 50 points

Thanks!

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TLC77: TLC7705QD